Laser cutting preparation technology of solid wood parquet laminate flooring
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Abstract
This study adopted orthogonal experiment to confirm the optimum technological parameters of laser cutting of solid wood parquet laminate flooring. We took tree species, focal distance, cutting speed, light intensity and cutting angle as design factors of the scheme and seam width, seam depth and ablation degree as evaluation indexes, the stereomicroscope was used to test the result. The result showed that influencing factors on the seam width from strong to weak followed the order of focal distance > cutting angle > cutting speed > tree species > light intensity, and the optimum conditions were A4B4C5D1E1, in which focal distance had a great effect on seam width. The factors influencing ablation degree were ranked from high to low as focal distance > cutting speed > cutting angle > tree species > light intensity, and the optimum conditions were A1B1C2D5E4, in which focal distance had a great influence on ablation degree. The factors impacting seam depth were ranked from strong to weak as cutting speed > tree species > focal distance > light intensity > cutting angle, and the optimum conditions were A5B4C1D5E5. Because of interaction of various factors, there was no remarkable influencing factor to seam depth. Laser cutting parameters of oak face veneer were: focal distance 6.0mm, cutting speed 30mm/s, and light intensity 75-80cd. Laser cutting parameters of Fraxinus mandschurica face veneer were focal distance 6.0-7.5mm, cutting speed 30-40mm/s, and light intensity 40-60cd. Reasonable use of cutting parameters may acquire good cutting quality, reduce or have no need of subsequent processing crafts so as to fulfill the demands of parquet flooring such as covering ablation degree and handling the gaps.
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