Evaluation of heat transfer performance of engineered wood flooring with built-in electric heating semi-conductive layer
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摘要:目的 以物理力学性能达标为前提，研究不同材料与结构组成的半导体制热多层实木复合地板的电热性能，为电热地板的优化设计提供理论依据。方法 从电热地板的构效关系角度出发，以地板断面密度为核心，采用材种优选、正交组坯和结构对称等方式设计出4种不同的电热地板结构方案。通过分析不同结构地板断面密度对传热效果的影响，比较评价其电热性能和使用能耗。结果 为保证传热效率，半导体电热层应置于基材和面板之间，功率密度应设置在200 ~ 300 W/m2的范围内，更为科学合理。经综合评价电热地板的传热效率、保温性能和能耗等指标，基材为混合树种的C结构，即表层为2层桦木，芯层为3层桉木的对称结构为设计方案中的最优结构。C结构电热地板在功率密度为300 W/m2时表面平衡温度达到47.3 ℃，电—热辐射转换效率为76.7%，平均自然降温幅度为29.3%。达到目标温度45.4 ℃所消耗的电量为1 877.4 × 10−3 kW·h。结论 不同材种与结构的地板断面密度差异较大，对导热系数、传热过程与电热性能有显著影响。在制备电热地板基材时，采用密度高、导热系数高、强度大的材种作外层，密度低、导热系数低、强度小的材种作芯层，形成“夹芯”结构可在保证电热地板尺寸稳定性等物理力学性能的基础上有效改善电热性能与能耗。Abstract:Objective This study aimed to provide a theoretical basis for the optimal design of the electrothermal flooring. On the basis of ensuring physical and mechanical properties, the influence of material composition and floor structure on the electric heating performance of the semiconductor heating multi-layer engineered wood flooring was explored.Method Four distinct structural schemes of the electrothermal floor were constructed using wood species optimization, orthogonal compounding, and structural symmetry with the cross-sectional density of the floor as the central focus of the structure-function connection. The electrothermal performance and energy consumption were compared and assessed by examining the impact of floor section density on the effect of heat transmission.Result In order to ensure the heat transfer efficiency, the semiconductor electric heating layer should be placed between the substrate and the surface layer, and the power density was suggested to be set within the range of 200–300 W/m2. After comprehensive evaluation of the heat transfer efficiency, thermal insulation performance and energy consumption of the electrothermal floor, C-structure with mixed tree species was the optimal structure, in which the symmetrical structure of two layers of birch was chosen as the surface layer and three layers of eucalyptus in the core layer. When the power density of C-structure electrothermal floor was set to300 W/m2, the maximum surface temperature reached 47.3 ℃, the electric-thermal radiation conversion efficiency was 76.7%, and the average temperature amplitude of natural cooling-down was 29.3%. The electricity consumed to reach the target temperature of 45.4 ℃ was 1 877.4 × 10−3 kW·h.Conclusion The density of floor cross section varies with different wood types and structures, which has a significant effect on thermal conductivity, heat transfer process and electrothermal performance. In the preparation of electrothermal floor substrate, the wood with high density, high thermal conductivity and high strength is suggested to use as the outer layer, and the wood with low density, low thermal conductivity, and low strength to use as the core layer. On the basis of assuring physical and mechanical features including dimensional stability, the “sandwich” structure formed by the electrothermal fool may significantly increase electrothermal performance and energy consumption.
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图 3 不同结构基材的断面密度分布曲线
Figure 3. Cross-sectional density distribution curves of substrates with different structures
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图 4 不同结构基材的导热系数
Figure 4. Thermal conductivity of electric heating engineered wood flooring substrates with different structures
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图 5 电热地板传热过程示意图
Figure 5. Schematic diagram of heat transfer process of electric heating floor
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图 6 不同结构电热地板表面温度变化曲线图
Figure 6. Surface temperature variation curves of electric heating engineered wood flooring with different structures
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图 7 不同功率密度下4种结构电热地板的电—热辐射转换效率
Figure 7. Electrical-thermal radiation conversion efficiency of four kinds of electric heating engineered wood flooring under different power densities
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图 8 不同结构电热地板的表面电—热辐射转换效率
Figure 8. Surface electric-thermal radiation conversion efficiency of electric heating engineered wood flooring with different structures
表 1 不同结构电热地板的升温耗电量
Table 1 Heating power consumption of electric heating floor with different structures
地板结构 Floor structure 结构A Structure A 结构B Structure B 结构C Structure C 结构D Structure D 室内温度 Indoor temperature/℃ 22.4 22.4 22.4 22.4 升温耗时 Heating time consumption/s 1 980 1 515 1 440 1 200 耗电量 Power consumption/（kW·h） 2 727.3 × 10−3 2 058.5 × 10−3 1 877.4 × 10−3 1 515.3 × 10−3 
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