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    拼花实木复合地板激光切割制备工艺研究

    Laser cutting preparation technology of solid wood parquet laminate flooring

    • 摘要: 为确定激光切割拼花实木复合地板的优化工艺参数,采用正交试验法,以树种、焦距、切割速度、光强和切割角度为因素设计试验方案,以缝宽、缝深、烧蚀程度为评价指标,采用体视显微镜检测试验结果。结果表明:激光切割对缝宽影响的因素主次为焦距>切割角度>切割速度>树种>光强,最优工艺是A4B4C5D1E1,焦距对缝宽影响显著;对烧蚀程度影响的因素主次为焦距>切割速度>切割角度>树种>光强,最优工艺是A1B1C2D5E4,焦距对烧蚀程度影响显著;对缝深影响的因素主次为切割速度>树种>焦距>光强>切割角度,最优工艺是A5B4C1D5E5,由于各种因素有交互作用,造成没有对缝深影响显著的因素。柞木表板激光切割参数为焦距6.0mm、切割速度30mm/s、光强75~80cd,水曲柳表板的激光切割参数为焦距6.0~7.5mm、切割速度30~40mm/s、光强40~60cd。采用合理的切割参数可以获得较好的切割质量,减少甚至无需遮盖烧蚀程度、处理拼装离缝等后续的加工工艺,即满足地板拼花的需要。

       

      Abstract: This study adopted orthogonal experiment to confirm the optimum technological parameters of laser cutting of solid wood parquet laminate flooring. We took tree species, focal distance, cutting speed, light intensity and cutting angle as design factors of the scheme and seam width, seam depth and ablation degree as evaluation indexes, the stereomicroscope was used to test the result. The result showed that influencing factors on the seam width from strong to weak followed the order of focal distance > cutting angle > cutting speed > tree species > light intensity, and the optimum conditions were A4B4C5D1E1, in which focal distance had a great effect on seam width. The factors influencing ablation degree were ranked from high to low as focal distance > cutting speed > cutting angle > tree species > light intensity, and the optimum conditions were A1B1C2D5E4, in which focal distance had a great influence on ablation degree. The factors impacting seam depth were ranked from strong to weak as cutting speed > tree species > focal distance > light intensity > cutting angle, and the optimum conditions were A5B4C1D5E5. Because of interaction of various factors, there was no remarkable influencing factor to seam depth. Laser cutting parameters of oak face veneer were: focal distance 6.0mm, cutting speed 30mm/s, and light intensity 75-80cd. Laser cutting parameters of Fraxinus mandschurica face veneer were focal distance 6.0-7.5mm, cutting speed 30-40mm/s, and light intensity 40-60cd. Reasonable use of cutting parameters may acquire good cutting quality, reduce or have no need of subsequent processing crafts so as to fulfill the demands of parquet flooring such as covering ablation degree and handling the gaps.

       

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